Semiconductor Advanced Packaging (2021)
Semiconductor Advanced Packaging (2021)
By John H Lau
Paperback
AED
576
20
AED 1,252.00
53% OFF
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Semiconductor Advanced Packaging (2021)
Semiconductor Advanced Packaging (2021)
By John H Lau
Hardcover
AED
804
02
AED 1,856.00
56% OFF
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Heterogeneous Integrations (2019)
Heterogeneous Integrations (2019)
By John H Lau
Hardcover
AED
755
08
AED 1,082.00
30% OFF
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Fan-Out Wafer-Level Packaging (2018)
Fan-Out Wafer-Level Packaging (2018)
By John H Lau
Hardcover
AED
663
29
AED 1,117.00
40% OFF
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Solder Joint Reliability: Theory and Applications (Softcover Reprint of the Original 1st 1991)
Solder Joint Reliability: Theory and Applications (Softcover Reprint of the Original 1st 1991)
By John H Lau
Paperback
(1)
AED
1,028
23
AED 2,882.00
64% OFF
Turbo
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Chip on Board: Technology for Multichip Modules (1994)
Chip on Board: Technology for Multichip Modules (1994)
By John H Lau
Hardcover
(1)
AED
1,042
21
AED 2,412.00
56% OFF
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Handbook of Tape Automated Bonding (1992)
Handbook of Tape Automated Bonding (1992)
By John H Lau
Hardcover
AED
1,047
57
AED 1,452.00
27% OFF
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Solder Joint Reliability: Theory and Applications (1991)
Solder Joint Reliability: Theory and Applications (1991)
By John H Lau
Hardcover
(1)
AED
1,045
37
AED 1,889.00
44% OFF
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Mechanics of Solder Alloy Interconnects (1994)
Mechanics of Solder Alloy Interconnects (1994)
By Darrel R Frear, Steven N Burchett, Harold S Morgan, John H Lau
Hardcover
(2)
AED
1,035
94
AED 1,719.00
39% OFF
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